MCIMX6U1AVM08AC

The i.MX 6Solo/6DualLite processors are specifically useful for applications such as web and multimedia tablets.

The i.MX 6Solo/6DualLite processors feature a single/dual Arm Cortex-A9 core operating at speeds of up to 1 GHz. They include 2D and 3D graphics processors, 1080p video processing, and integrated power management. Each processor provides a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory interface and various interfaces for connecting peripherals like WLAN, Bluetooth, GPS, hard drives, displays, and camera sensors . These processors are specifically useful for applications such as web and multimedia tablets, color eReaders, IPTV, human-machine interfaces (HMI), portable medical devices, IP phones, and home energy management systems . The i.MX 6Solo/6DualLite processors enhance the capabilities of high-tier portable applications by meeting the increasing MIPS requirements of operating systems and games. They feature Dynamic Voltage and Frequency Scaling (DVFS) for significant power reduction, allowing the device to operate at lower voltage and frequency while maintaining sufficient MIPS for tasks like audio decoding. The processors also have a multilevel memory system based on L1 instruction and data caches, L2 cache, and internal and external memory, supporting various external memory devices such as DDR3, DDR3L, LPDDR2, and NOR Flash . Additionally, the i.MX 6Solo/6DualLite processors are based on the Arm Cortex-A9 MP Core Platform, with the i.MX 6Solo supporting a single Arm Cortex-A9 MPCore and the i.MX 6DualLite supporting dual Arm Cortex-A9 MPCore. The processors have symmetric core configurations and integrated power management features, including linear regulators and internally generated voltage levels for different domains, simplifying system power management structure . In summary, the i.MX 6Solo/6DualLite processors offer a range of features such as high-speed operation, graphics processing, power management, memory system support, and application-specific capabilities for various consumer and industrial products

The package information provided for the NXP Semiconductors includes details such as the plastic package, BGA case size of 21 x 21 mm with 0.8 mm pitch, and ordering information.