News on April 16 It is reported that SK Hynix is negotiating with the German auto giant Bosch (Bosch) to provide it with car memory chips.
It is said that SK Hynix has completed the development of memory chips that meet Bosch's specifications. Compared with DRAM used in consumer devices, DRAM used in automobiles has higher reliability and a wider activation temperature range. The new DRAM developed by SK Hynix follows the second edition of the ISO26262 standard formulated in 2018.
ISO26262 "Road Vehicle Functional Safety Standard" was formulated in November 2011. It covers 11 parts of software specifications, verification and other requirements specifications. The second edition of the standard adds semiconductor design guidelines, which include failure rates. When the activation temperature is too high or there is noise, the failure rate will increase. Chips that are too large may also increase the failure rate, which means that the switching rate on them is higher. The standard also requires error correction code blocks on the chip.
Since 2016, SK Hynix has always had a team specializing in the development of automotive memory chips. This team originally had only 9 members, but it is now close to 100 people, led by Shim Daeyong, Hynix's vice president and head of automotive.
In August last year, Shim said that the company is developing technologies such as error correction codes, built-in self-checks, and car memory cyclic redundancy checks. SK Hynix is also developing battery technologies with high heat resistance and error correction capabilities.
According to data, by 2020, car infotainment systems will use 1GB to 2GB of DRAM. It is estimated that by 2023, DRAM capacity will increase to 6GB and 8GB. As more advanced automated driving assistance systems are being commercialized, the specification requirements for automotive DRAM are also increasing.
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